Preparation and Thermal Properties of Graphene/PI Nanocomposites

Polyimide (PI) is a high performance polymer material with excellent thermal stability and electrical insulation property. However, the low thermal conductivity of PI limits its wider application. Graphene (GNS) is ideal filler because of its incredible physical and chemical properties to reinforce the thermal and mechanical performance of polymer based matrix. In this work, we report an effective method using in situ polymerization to prepare graphene/polyimide (GNS/PI) and graphene oxide/ polyimide (GNO/PI) composite films with good thermal properties. When the content of GNS is 0.75%, the thermal conductivity value of GNS/PI film reaches 0.1375 W/m.k, which is 47.1% higher than pure PI film. This approach shows a potential application in microelectronics and aircraft industries and can be further investigated and optimized.