Parametric Analysis and Modeling of die-sinking Electric Discharge Machining of Al6061/SiC Metal Matrix Composite Using Copper Electrode
- Authors: Bipul Kumar Singh1, Ankit Kumar Maurya2, Sanjay Mishra3, Anjani Kumar Singh4
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View Affiliations Hide AffiliationsAffiliations: 1 Mechanical Engineering Department, Madan Mohan Malaviya University of Technology, Gorakhpur, Uttar Pradesh, India 2 Mechanical Engineering Department, Madan Mohan Malaviya University of Technology, Gorakhpur, Uttar Pradesh, India 3 Mechanical Engineering Department, Madan Mohan Malaviya University of Technology, Gorakhpur, Uttar Pradesh, India 4 Mechanical Engineering Department, Madan Mohan Malaviya University of Technology, Gorakhpur, Uttar Pradesh, India
- Source: Manufacturing and Processing of Advanced Materials , pp 114-126
- Publication Date: December 2023
- Language: English
Parametric Analysis and Modeling of die-sinking Electric Discharge Machining of Al6061/SiC Metal Matrix Composite Using Copper Electrode, Page 1 of 1
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Aluminum-based metal matrix composites (MMC) are widely used in modern industries due to their lightweight, high strength, and superior hardness. In this study, silicon carbide (SiC) reinforced MMC has been fabricated using the stir casting method. Die-sinking EDM of fabricated MMC was performed using a copper (Cu) electrode. Experiments were carried out using the response surface methodology of box-behnken design (BBD) (RSM). The response surface plot was used to do parametric analysis on the effect of peak current (Ip ), gap voltage (Vg ), pulse-on-time (Ton), and duty factor(τ) on material removal rate (MRR) and surface roughness (Ra) using a second order regression model. The interaction effect of current with a pulse on time and duty factor has a substantial effect on MRR, while the interaction of current and voltage has a major impact on Ra, according to ANOVA. The increase of current increases both MRR and Ra. In the case of pulse-on-time, the value of Ra begins to decrease after 150 µs when the machining is performed at low voltage (40 V). <br>
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